Mounting structure for electronic circuit modules

Details Mounting structure for electronic circuit modules Mounting structure for electronic circuit modules

1986-02-03

1987-07-21

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361413, H05K 720

Patent

active

046822682

ABSTRACT:
A mounting structure for electronic circuit modules includes electronic circuit modules each having a back panel, heat-generating electronic components each having a heat sink for heat radiation and mounted on one surface of the back panel, and first connectors mounted on the other surface of the back panel. A frame has first holes and a hollow inside structure for mounting the electronic circuit modules. Cable assemblies having second connectors at their ends pass through one of the first holes to connect with the first connectors within the frame. The electronic circuit modules are mounted onto the frame. The modules may be mounted onto the frame by second holes penetrating the back panel and guide pins formed on the frame in one-to-one correspondence with the second holes. A heat radiating structure may include openings opposed to the heat sinks in one-to-one correspondence, and fans for sucking air from the vicinity of the heat sinks into the inside of the heat radiating structure through the openings.

REFERENCES:
patent: 3940665 (1976-02-01), Seki
patent: 4158875 (1979-06-01), Tajima et al.
patent: 4403271 (1983-09-01), Flanigan
patent: 4519013 (1985-05-01), Breeze
E. A. Wilson, "Accommodating LSI in a High Performance Computer", Electronic Packaging and Production, May 1982, pp. 142-152.

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