Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
1997-10-17
2001-02-27
Gaffin, Jeffrey (Department: 2841)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C174S260000, C174S251000, C361S775000, C361S773000
Reexamination Certificate
active
06194656
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a mounting structure for a relay which is mounted under a high temperature environment such as an engine room of an automobile.
2. Description of the Related Art
In general, when mounting a relay on a printed circuit board in an electric connection (junction) box of an automobile, a terminal of the relay is soldered thereon in an automatic process of a flow system.
In the related art, the printed circuit board of the electric connection box is fixed onto a case body by means of a screw. A relay is mounted on the printed circuit board, and then, the terminal of the relay is soldered to a printed wiring pattern on the printed circuit board. Moreover, in order to make an electrical connection with the outside, a connector terminal constituting a connector is soldered onto the printed circuit board.
In the case where the aforesaid electric connection box is mounted under a high temperature environment such as an engine room of an automobile, there is a possibility that among relay terminals, in particular, a temperature of a movable (COM) terminal exceeds a welding guaranteed level (guaranteed temperature) of a soldering joined part because the terminal is very exothermic.
In order to avoid the aforesaid disadvantage, it is considered that soldering is carried out so as to increase an amount of solder by manually or a solder having a high fusing point is used. However, this causes a problem of increasing cost.
SUMMARY OF THE INVENTION
The present invention has been achieved with such points in mind.
It therefore is an object of the present invention to provide a mounting structure for a relay, which can lower a temperature of a relay terminal so that a temperature of a solder welding part for making a connection between a printed circuit board and the relay is made less than a guaranteed level.
It is another object of the present invention to provide a mounting structure for a relay which can prevent the reliability of a solder junction from being lowered by a rise of the temperature of relay terminal.
To achieve the object, according to a first aspect of the present invention, there is provided a mounting structure for a relay arranged on a printed circuit board, comprising: a resin block having a relay mounting opening to be inserted with the relay; and a bus bar insert-molded in the resin block having a first end to be connected with a terminal of the relay by welding and a second end to be soldered to a printed wiring pattern formed on the printed circuit board.
With the aforesaid mounting structure, since a heat of the terminal of the relay which becomes high in temperature is absorbed through the bus bar and the resin block, a temperature of the soldering part of the printed circuit board and the bus bar does not rise so much.
In particular, since the terminal of the relay is connected to the printed circuit board via the bus bar inserted into the resin block without directly soldering the terminal to the printed circuit board, the heat of the relay terminal which becomes high in temperature can be absorbed through the bus bar and the resin block. Thus, even if the bus bar is soldered to the printed circuit board in the automatic process of the flow system, the temperature of the soldering part can be suppressed less than the guaranteed level, and also, reliability of the soldering part can be secured. Therefore, there is no need of carrying out manual soldering and using a solder having a high fusing point, so that an increase of cost can be suppressed.
According to a second aspect of the present invention, as it depends from the first aspect, the mounting structure for a relay further comprises a second bus bar insert-molded in the resin block having a first end to be connected with a terminal of the relay by welding and a second end connecting to a connector to be connected to the mounting structure.
With the aforesaid mounting structure, in particular, since the movable terminal of the relay which is very exothermic is directly connected to the outside connector without soldering it to the printed circuit board, there is no need of taking a rise of temperature of the terminal into consideration.
According to a third aspect of the present invention, as it depends from the first aspect or the second aspect, the first end of the bus bar is formed with a bent portion being overlapped with the terminal of the relay; and the bent portion of the bus bar is connected with the terminal of the relay by welding in a state that the bent portion and the terminal of the relay are overlapped each other.
With the aforesaid mounting structure, the reliability of the welding part of the terminal of the relay and the bus bar can be enhanced.
According to a fourth aspect of the present invention, as it depends from any one of the first aspect to the third aspect, the resin block has a rectangular parallelepiped shape; a plurality of the relay mounting openings are formed in line on the middle in a width direction of the resin block to be inserted with a plurality of the relays; a plurality of the bus bars extend from each of the relay mounting openings to both sides in the width direction of the resin block; a plurality of the first ends of the bus bar are connected to the terminals of the relays by welding; and a plurality of the second ends of the bus bars are projected into the outside from the both sides in the width direction of the resin block.
With the aforesaid mounting structure, many relays are orderly arranged. Also, since the bus bar extends to both sides in the width direction of the resin block, a heat is hard to remain in the resin block, and the heat is easy to be further absorbed through the bus bar.
According to a fifth aspect of the present invention, as it depends from any one of the first aspect to the fourth aspect, the resin block has a rectangular parallelepiped shape and has a fixing surface to be fixed onto the printed circuit board; the first end of the bus bar is projected from the side opposite to the fixing surface to be fixed onto the printed circuit board to be connected to the terminal of the relay; and the second end of the bus bar is projected from the fixing surface to be fixed onto the printed circuit board to be soldered to the printed wiring pattern formed on the printed circuit board.
With the aforesaid mounting structure, since a heat of the terminal of the relay which becomes high temperature is absorbed through the bus bar and the resin block, a temperature of the soldering part of the printed circuit board and the bus bar does not rise so much. In this case, in the present invention, since the terminal of the relay and the other end of the bus bar are joined together on the side opposite to the fixing surface of the resin block, the bus bar which is insert-molded in the resin block is projected into the fixing surface side can be made long. Thus, the heat of the terminal of the relay is easy to be further absorbed.
According to a sixth aspect of the present invention, as it depends from the fifth aspect, the relay is mounted into the resin block from the fixing surface side, and the relay and the resin block are received in a case body together with the printed circuit board.
With the aforesaid mounting structure, since the relay is mounted into the resin block, the terminal of the relay and the first end of the bus bar are preferably connected to, and a further secure connection can be provided. Therefore, the relay does not tremble by an inertia force of oneself due to vibration and impact, so that a strong structure can be provided.
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patent: 3588618 (1971-06-01), Ohe
patent: 3771101 (1973-11-01), Elkins
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patent: 5065283 (1991-11-01), Adachi et al.
patent: 5122621 (1992-06-01), Rohde et al.
patent: 5686698
Kondo Youichi
Suzuki Masataka
Watanabe Yasuyuki
Cuneo Kamand
Gaffin Jeffrey
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Yazaki -Corporation
LandOfFree
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