Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2007-09-11
2007-09-11
Louie, Wai-Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S048000, C257S084000, C257S088000, C257S091000, C257S093000, C257S099000
Reexamination Certificate
active
11124578
ABSTRACT:
A mounting structure includes a mounting substrate on which a plurality of mounting pads each constituting a portion of a conductive pattern extending in a Y direction are arranged in an X direction, the X direction and the Y direction being two directions orthogonal to each other, and a member that is mounted on the mounting substrate so as to be electrically connected to the mounting pads. In the mounting structure, a first conductive layer, an insulating layer, a second conductive layer, and a third conductive layer are formed on the mounting substrate in this order from a lower side to an upper side. In addition, each conductive pattern includes the mounting pad that has a three-layered structure formed by laminating the first conductive layer, the insulating layer, and the third conductive layer, which is an outermost layer, in this order, a test pad that is positioned adjacent to a region where the mounting pad is formed, outside a region where the member is mounted, and that has the three-layered structure formed by laminating the first conductive layer, the insulating layer, and the third conductive layer, which is the outermost layer, in this order, and a lead portion that extends from the test pad, and that has a two-layered structure of the first conductive layer and the insulating layer, which is an outermost layer.
REFERENCES:
patent: 4643526 (1987-02-01), Watanabe et al.
patent: 4955695 (1990-09-01), Kubo et al.
patent: 5608559 (1997-03-01), Inada et al.
patent: 2003-036039 (2003-02-01), None
Armand Marc-Anthony
Harness & Dickey & Pierce P.L.C.
Louie Wai-Sing
Seiko Epson Corporation
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