Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2006-08-04
2008-12-30
Louie, Wai-Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S665000, C257S688000, C257S783000, C257SE23160
Reexamination Certificate
active
07470986
ABSTRACT:
A mounting structure is provided. The mounting structure includes: a substrate; a line formed on the substrate; an electronic component in which a terminal having a protrusion protruded to the substrate and made of an elastic material and a conductive member disposed on the protruded surface of the protrusion and electrically connected to the line is disposed on a mounting surface of the electronic component opposed to the substrate; and an adhesive in which metal powders, a part of which is interposed between the conductive member and the line, are mixed and which serves to bond and fix the electronic component to the substrate. Here, the conductive member and the line interpose the metal powders therebetween and come in surface-contact with each other.
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Harness & Dickey & Pierce P.L.C.
Louie Wai-Sing
Sanyo Epson Imaging Devices Corp.
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