Mounting structure and mounting method of a semiconductor...

Details Mounting structure and mounting method of a semiconductor... Mounting structure and mounting method of a semiconductor...

2006-03-14

2008-12-16

Qi, Mike (Department: 2871)

Liquid crystal cells, elements and systems

Particular structure

Having significant detail of cell structure only

C349S151000, C349S152000, C345S090000

Reexamination Certificate

active

07466388

ABSTRACT:
A mounting structure of a semiconductor device includes an electroconductive film provided on a substrate. An insulating film is formed on the electroconductive film, and provided with an opening portion to expose a part of the electroconductive film, and its internal stress is set to serve as a compression stress. An anisotropic electroconductive binding material is disposed across the part of the electroconductive film exposed by the opening portion and the insulating film. A semiconductor device has a plurality of electrodes, and is disposed on the anisotropic electroconductive binding material. The electrodes are electrically connected with the electroconductive film through the anisotropic electroconductive binding material.

REFERENCES:
patent: 5748179 (1998-05-01), Ito et al.
patent: 9-80456 (1997-03-01), None
patent: 2004-214374 (2004-07-01), None
patent: 10-2001-0104667 (2001-11-01), None

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