Mounting structure and mounting method

Details Mounting structure and mounting method Mounting structure and mounting method

2009-06-18

2011-12-20

Thai, Luan C (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S778000, C257S781000, C257S737000, C257S738000, C257SE23021, C257SE23069

Reexamination Certificate

active

08080884

ABSTRACT:
A mounting structure of the present invention includes a semiconductor element101, a circuit board301having electrodes302opposed to electrodes102of the semiconductor element101, and conductive two-layer bumps213. Second bumps210joined to the electrodes302of the circuit board301are formed larger than first bumps209joined to the electrodes102of the semiconductor element101. The axis of the first bump209and the axis of the second bump210are not aligned with each other.

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