Mounting structure and method for mounting electronic...

Electricity: conductors and insulators – Boxes and housings – With electrical device

Reexamination Certificate

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C174S521000, C174S534000, C264S272150

Reexamination Certificate

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08053684

ABSTRACT:
An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.

REFERENCES:
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patent: 6036908 (2000-03-01), Nishida et al.
patent: 6128195 (2000-10-01), Weber et al.
patent: 6482346 (2002-11-01), Alcazar
patent: 2002/0029900 (2002-03-01), Wimberger et al.
patent: 2002/0109264 (2002-08-01), Lechner
patent: 9-283195 (1997-10-01), None
patent: 10-172713 (1998-06-01), None
patent: 11-40917 (1999-02-01), None
patent: 2002-86487 (2002-03-01), None
patent: 2003-197068 (2003-07-01), None
patent: 2003-288971 (2003-10-01), None
Machined Translation for JP 10-172713 Apr. 23, 2011, 10 pages.
International Search Report for International Application No. PCT/JP2006/325252 mailed Mar. 13, 2007.
Japanese Office Action for Application No. 2006-104285 mailed Jul. 5, 2011 with English translation.

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