Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent
1991-06-28
1993-04-27
LaRoche, Eugene R.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
257722, H01L 3902
Patent
active
052067130
ABSTRACT:
A mounting for a semiconductor chip is composed substantially of polysilicon materials and incorporates integral heat dissipating elements into its design. The mounting can be cast from molten polysilicon or machined from a block of solid polysilicon depending on the shape and complexity of design of the mounting and heat dissipating elements. Polysilicon has excellent heat transfer properties and is closely matched to silicon in its coefficient of thermal expansion thereby reducing mechanical stress between the mounting and the chip. The semiconductor chip is attached directly to the polysilicon mounting establishing a direct thermal pathway between the heat generating chip and the heatsink elements of the mounting. The configuration of using direct attachment to a polysilicon mounting creates a thermally efficient package with greatly enhanced heat transfer capabilities and reduced mechanical stress. The mounting can accommodate both single and multi-chip applications in a variety of arrangements. The packages made from polysilicon can therefore become an integral and active part of the functionality of the chip from the point of view of interconnect, signal integrity and thermal management while also improving manufacturability and long term reliability.
REFERENCES:
patent: 4079506 (1978-03-01), Suzuki et al.
patent: 4310965 (1982-01-01), Horiuchi et al.
patent: 4322737 (1982-03-01), Sliwa, Jr.
patent: 4630096 (1986-12-01), Drye et al.
patent: 4631804 (1986-12-01), Roy
patent: 4689659 (1987-08-01), Watanake
patent: 4698662 (1987-10-01), Young et al.
patent: 4745455 (1988-05-01), Glascock, II et al.
patent: 4774632 (1988-09-01), Neugebauer
patent: 4933746 (1990-06-01), King
patent: 4951123 (1990-08-01), Lee et al.
patent: 5016083 (1991-05-01), Ishii et al.
patent: 5049981 (1991-09-01), Dahringer
patent: 5063177 (1991-11-01), Gellen et al.
Kearney, "Assembly Automation Accommodates Advanced VLSI Packaging", Semiconductor International, Nov. 1988, p. 38.
Sikorski et al., "A Systems Approach to the Evaluation of Packaging Design Alternatives", The International Journal for Hybrid Microelectronics, vol. 12, No. 2, Jun. 1989, pp. 102-110.
Collins, "Initiative fives fillip to flip chip research", Electronics Times, Jan. 25, 1990, p. 23.
Digital Equipment Corporation
Hudgens Ronald C.
LaRoche Eugene R.
Myrick Ronald E.
Nguyen Viet Q.
LandOfFree
Mounting silicon chips does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mounting silicon chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mounting silicon chips will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2331845