Mounting pad with tubular projections for solid-state devices

Electricity: conductors and insulators – Insulators – Special application

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Details

165185, 174 16HS, 277189, 361403, H01B 1756, H05K 700, H01L 2314

Patent

active

046021256

ABSTRACT:
A thermally conductive electrically insulative laminate for use as a mounting pad and electrical chassis barrier for use with solid-state electronic devices. The pad includes a number of bores with tubular projections extending outwardly therefrom for insulatively protecting the shanks of the mounting screws, bolts or other conductive materials from contact with the substrate. Additionally, the tubular projections are provided with radially extending retention burrs for mechanically holding the mounting pad in place on a substrate pending actual mounting of a semiconductor device thereon.

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patent: 3701075 (1972-10-01), Schullstrom et al.
patent: 4211890 (1980-07-01), Sado et al.
patent: 4395585 (1983-07-01), Polcyn

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