Mounting pad for solid-state devices

Details Mounting pad for solid-state devices Mounting pad for solid-state devices

1984-02-29

1986-03-11

Askin, Laramie E.

Heat exchange

Heat transmitter

174 16HS, 174138G, 361403, 428447, 4284735, F28F 300, B32B 2520, B32B 3300, H05K 720

Patent

active

045748799

ABSTRACT:
A thermally conductive electrically insulative laminate for use as chassis barriers in combination with solid-state electronic devices, the laminate comprising at least three layers and including a pair of outer layers disposed on opposite sides of a center layer. The center layer comprises a film of a polyimide (amide) filled with a quantity of either aluminum oxide or boron nitride particulate solids and included in an amount ranging from between about 10% to about 50% by volume. The outer layers consist essentially of silicone base rubber, and are preferably filled with a quantity of aluminum oxide or boron nitride particulate solids in an amount ranging from between about 25% and 50% by volume.

REFERENCES:
patent: 3391242 (1968-07-01), Sudges
patent: 4448840 (1984-05-01), Matsushita
patent: 4471837 (1984-09-01), Larson
Donegan, M. J. et al., "Heat Conducting Washer", IBM Technical Disclosure Bulletin, vol. 8, No. 1, Jun. 1965, p. 206.

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