Mounting of semiconductor chips on a plastic substrate

Details Mounting of semiconductor chips on a plastic substrate Mounting of semiconductor chips on a plastic substrate

1986-11-26

1989-03-21

Hearn, Brian E.

Fishing, trapping, and vermin destroying

29832, 29739, 357 80, 361331, H01L 300

Patent

active

048142956

ABSTRACT:
A semiconductor chip mounting is provided by molding a substrate of heat resistant synthetic resin, forming contact pads, which may be protrusions or recesses, on a surface of the substrate as it is molded. A circuit pattern extends to the contact pads which have a conductive surface. The chip is directly mounted on the substrate by soldering contact areas on the chip to the contact pads on the substrate, thus avoiding wire bonding.

REFERENCES:
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patent: 3675089 (1972-07-01), Hantusch et al.
patent: 4088546 (1978-05-01), Wu et al.
patent: 4423435 (1983-12-01), Test, II
patent: 4682270 (1987-07-01), Whitehead et al.
Schmieg, "Dip Storage Module with Stacked Chips", IBM Technical Disclosure Bulletin, vol. 23, No. 6, Nov. 1980, p. 2337.
Doo et al, "Semiconductor Chip Cooling Package", IBM Technical Disclosure Bulletin, vol. 20, No. 4, Sep. 1977, pp. 1440-1441.
Liu et al, "Integrated Circuit Chip Package", IBM Technical Disclosure Bulletin, vol. 17, No. 7, Dec. 1974.

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