Mounting of high density components on substrate

Details Mounting of high density components on substrate Mounting of high density components on substrate

1988-12-28

1991-02-19

Thompson, Gregory D.

Electricity: electrical systems and devices

Miscellaneous

29840, 361403, H05K 118

Patent

active

049949381

ABSTRACT:
A printed circuit board or other substrate mounts electrical components substantially coplanar with the median plane or thickness of the board or substrate. The board furnishes an opening having bonding pads plated through the opening and fixed on the opposite sidewalls of the opening. The electrical component becomes placed in the the opening with solder paste between the bonding pads and end terminals of the electrical component. Reflow soldering techniques melt the solder paste into solder filets that solidify to fasten the electrical component within the opening in coplanar with the median plane or thickness of the board.

REFERENCES:
patent: 4732446 (1988-03-01), Gipson et al.

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