Mounting of electronic microcomponents on a support

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29843, 361388, 361405, 361406, H05K 334

Patent

active

049599003

ABSTRACT:
For flat mounting of electronic microcomponents, such as chip carriers, on a printed circuit support, the electrical contacts of the microcomponent are connected to pads on the printed circuit, microcomponents having solderable contacts on a lower face thereof, comprising electrically connecting said solderable contacts of the microcomponent to respective pads on the printed circuit through sections of flexible wires having a sufficient degree of curvature for mechanically uncoupling said microcomponents from said printed circuit support and mechanically connecting the microcomponent to the support through a spacer having planar dimensions lower than planar dimensions of a base of said microcomponent for providing access to said contacts for connecting said sections thereto. An intermediate product includes the chip carrier and a grid conencted to the lower face thereof, including connecting sections and an edge strip connecting the external ends of all sections.

REFERENCES:
patent: 3700788 (1972-10-01), Spurck
patent: 4381602 (1983-05-01), McIver
patent: 4750089 (1988-06-01), Derryberry et al.
patent: 4827611 (1989-05-01), Pai et al.

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