Metal fusion bonding – Process – With supplementary mechanical joining
Patent
1982-09-27
1985-05-07
Ramsey, Kenneth J.
Metal fusion bonding
Process
With supplementary mechanical joining
228187, 228248, 2281801, 2281802, H05K 334
Patent
active
045153043
ABSTRACT:
Mounting of leaded components on one side of a PCB and surface mounting components on the other side of the PCB creates problems. The pressure of the lead ends projecting through the PCB prevents the use of a mask for applying solder paste for the mounting of the surface mounting components. Attaching surface mounting components initially by adhesive prior to wave soldering also causes problems. In the present invention leaded components are inserted and the lead ends crimped. The board is then turned over, solder paste applied by individual applicator nozzles to the lead ends and to solder pads on the circuit pattern. The surface mounting components are then positioned with contact areas aligned with the solder pads and the whole reflow soldered. The process can be repeated for surface mounting components on the same side as the original leaded components, with or without the insertion of further leaded components on the same side as the original surface mounting components.
REFERENCES:
patent: 3583063 (1971-06-01), Growney
patent: 3904102 (1975-09-01), Chu et al.
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4334646 (1982-06-01), Campbell
patent: 4396140 (1983-08-01), Jaffe et al.
Jelly Sidney T.
Northern Telecom Limited
Ramsey Kenneth J.
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