Mounting of a compact circuit package to a heat sink or the like

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

29832, 206330, 165185, H05K 720

Patent

active

045464111

ABSTRACT:
A compact circuit package includes a housing providing a cavity for containing heat generating electrical components. A ceramic substrate is mounted to close the cavity. The package is adapted to be mounted in heat transferring relationship with a heat sink. The bottom surface of the compact circuit package is provided with a self-contained chamber containing a supply of grease. The chamber is defined by the package bottom surface and a bubble of plastic film which overlies the substrate and which is removable sealed to the package around the periphery of the substrate. In this form, the compact circuit package can be transported and stored until ready for use. When the package is ready to be mounted to a heat sink, pressure such as by a finger is applied to the top surface of the bubble film to thereby spreadingly apply the grease to the surface of the substrate. The film is then removed from the bottom of the compact circuit package and the greasey underside of the film placed into engagement with the heat sink surface and rubbed, as by a finger, to thereby spread the remaining residue grease onto the heat sink. The film is then removed and discarded and the compact circuit package mounted to the heat sink.

REFERENCES:
patent: 3958075 (1976-05-01), Kaufman
patent: 4092697 (1978-05-01), Spaight
patent: 4156148 (1979-05-01), Kaufman
patent: 4196411 (1980-04-01), Kaufman
patent: 4215235 (1980-07-01), Kaufman
patent: 4218724 (1980-08-01), Kaufman
patent: 4250481 (1981-02-01), Kaufman
patent: 4257091 (1981-03-01), Kaufman
patent: 4266140 (1981-05-01), Kaufman
patent: 4394530 (1983-07-01), Kaufman
patent: 4471837 (1984-09-01), Larson
patent: 4489487 (1984-12-01), Bura
On-Board Logic For . . . Printhead, Mizzi, IBM Tech. Discl. Bull., vol. 24, No. 1A, Jun. 1981, p. 284.

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