Mounting method of semiconductor device

Details Mounting method of semiconductor device Mounting method of semiconductor device

1997-08-27

2000-06-13

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438127, 438613, H01L 2144, H01L 2148, H01L 2150

Patent

active

06074894&

ABSTRACT:
A bump electrode made of an alloy of two or more kinds of metals is formed on an electrode pad portion of a semiconductor device by the laser ablation method and the bump electrode is reflow-soldered to electrically bond the bump electrode to a terminal electrode section on a circuit board. The semiconductor device and the terminal electrode section are encapsulated in resin by the laser ablation method.

REFERENCES:
patent: 4400870 (1983-08-01), Islam
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5393697 (1995-02-01), Chang et al.
patent: 5607877 (1997-03-01), Matsuda et al.
patent: 5658827 (1997-08-01), Aulicino et al .

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