Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-05-08
2000-06-20
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29832, 156299, B32B 3100, H01L 2152
Patent
active
060773820
ABSTRACT:
The invention provides a mounting method for a semiconductor chip, wherein after disposing the anisotropic conductive adhesive on a circuit board, the circuit board is preheated to a temperature lower than the hardening temperature of the anisotropic conductive adhesive, the semiconductor chip is disposed on the circuit board thereafter, and the anisotropic conductive adhesive is hardened by thermally press-bonding the semiconductor chip onto the circuit board by applying pressure as well as heat so that generation of air bubbles is minimized ensuring good adhesion therebetween. It is also possible to prevent occurrence of thermal strain by heating simultaneously the under surface of the circuit board at a temperature lower than a heating temperature for the semiconductor chip.
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Ball Michael W.
Citizen Watch Co., Ltd
Haran John T.
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