Mounting method of electronic components, manufacturing...

Details Mounting method of electronic components, manufacturing... Mounting method of electronic components, manufacturing...

2011-03-15

2011-03-15

Nguyen, Cuong Q (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000

Reexamination Certificate

active

07906370

ABSTRACT:
There is disclosed a fixing method of an electronic component or the like in which when the electronic component and a resin layer are fixed, warp and bend of the electronic component can be inhibited. During manufacturing of a semiconductor-embedded substrate200in which a semiconductor device220is embedded, after the semiconductor device220is disposed on an unhardened resin layer212, this device is stored in a container31of a pressurizing and heating unit3, and the semiconductor device220is isotropically pressurized using an internal gas in the container31as a pressure medium, whereby the semiconductor device220is pressed to the unhardened resin layer212, and the resin layer212is heated to harden. In consequence, the semiconductor device220is fixed and mounted on the resin layer212without being warped or bent.

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