Mounting method of electronic components

Details Mounting method of electronic components Mounting method of electronic components

2006-06-14

2009-06-23

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S607000, C198S836300

Reexamination Certificate

active

07549221

ABSTRACT:
Methods of mounting electronic components on a plurality of printed circuit boards simultaneously are provided. An exemplary method may include supplying a first printed circuit board to a first conveyor and then transferring the first printed circuit board to a second conveyor and simultaneously supplying a second printed circuit board to the first conveyor. The method may then include transferring the first printed circuit board to a third conveyor and the second printed circuit board to a third conveyor, and mounting electronic components on about half of the first printed circuit board by moving the first printed circuit board to one side and, simultaneously mounting electronic components on about half of the second printed circuit board. The method may then include sequentially transferring the first and second printed circuit boards to a fourth conveyor, and then sequentially discharging the first and second printed circuit boards.

REFERENCES:
patent: 4631812 (1986-12-01), Young
patent: 5778524 (1998-07-01), Stridsberg
patent: 6189674 (2001-02-01), Izumida et al.
patent: 6460692 (2002-10-01), Dionne et al.
patent: 6550135 (2003-04-01), Nakahara et al.
patent: 2002/0079192 (2002-06-01), Dionne et al.

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