Mounting method of bump-equipped electronic component and...

Details Mounting method of bump-equipped electronic component and... Mounting method of bump-equipped electronic component and...

2007-10-23

2007-10-23

Kerns, Kevin P. (Department: 1725)

Metal fusion bonding

Process

Using high frequency vibratory energy

C228S001100

Reexamination Certificate

active

11009451

ABSTRACT:
In a mounting method for mounting a bump-equipped electronic component5with a plurality of metallic bumps6on a substrate2with a plurality of electrodes3,during the process of connecting the metallic bumps6to the electrodes3by aligning the metallic bumps with the electrodes3with thermosetting resin4intervening between the electronic component5and substrate2and by pressing the electronic component5to the substrate2while exerting ultrasonic oscillation, heat and applied pressure on the electronic component5,all of the metallic bumps6are brought into contact with the electrodes so that they are electrically connected to each other, and when some of the metallic bumps are metallic-bonded to the electrodes, ultrasonic oscillation is stopped. Thus, it is possible to prevent occurrence of damage owing to the excessive exertion of ultrasonic oscillation on the metallic bumps which have precedently started their metallic-bonding.

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