Mounting method for a semiconductor component

Details Mounting method for a semiconductor component Mounting method for a semiconductor component

2008-01-29

2008-01-29

Luu, Chuong Anh (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S014000, C438S015000, C438S200000

Reexamination Certificate

active

07323359

ABSTRACT:
A mounting method for a semiconductor component. The method includes application of solder material to the semiconductor component, application of at least one contact/mounting element made of semiconductor material and/or metal and/or insulator material to the solder material, heating of at least one part of the semiconductor component to a temperature lying above the melting point of the solder material by impressing an electrical power into the semiconductor component, as a result of which corresponding soldering connections arise between the semiconductor component and the at least one contact/mounting element, and cooling of the connection complex that comprises the semiconductor component and at least one contact/mounting element and was produced in the preceding step.

REFERENCES:
patent: 3238425 (1966-03-01), Geyer
patent: 5126919 (1992-06-01), Yamamoto et al.
patent: 5954978 (1999-09-01), Seelert et al.
patent: 6031279 (2000-02-01), Lenz
patent: 6461891 (2002-10-01), Dishongh et al.
patent: 6554244 (2003-04-01), Remy De Graffenried et al.
patent: 6563225 (2003-05-01), Soga et al.
patent: 2002/0149114 (2002-10-01), Soga et al.
patent: 2002/0166688 (2002-11-01), Smith
patent: 1 254 773 (1968-05-01), None
patent: 15 14 561 (1975-10-01), None
patent: 0 875 331 (1998-11-01), None
patent: 1.480.792 (1967-12-01), None

Affiliated with

Also associated with

Rating

Mounting method for a semiconductor component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mounting method for a semiconductor component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mounting method for a semiconductor component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2803719