Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-10-25
2001-07-24
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S702000, C361S707000, C361S710000, C257S707000, C257S713000, C174S016300, C165S080300, C024S295000, C411S477000
Reexamination Certificate
active
06266244
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to methods and apparatus for mounting electrical components to structural members. It is disclosed in the context of mounting electrical components which evolve heat during their operation to a heat sink, but is believed to be useful in other applications as well.
BACKGROUND OF THE INVENTION
A number of assemblies and assembly methods have been proposed for mounting electrical components to, for example, the chassis of electrical devices. There are, for example, the devices and methods illustrated and described in U.S. Pat. Nos. 4,193,444; 4,204,248; 4,288,839; 4,509,839; 4,707,726; 5,060,112; 5,122,480; 5,309,979; 5,321,582; 5,327,324; 5,363,552; 5,369,879; and, 5,812,376, to identify but a few. This listing is not intended as a representation that a thorough search of the prior art has been conducted or that no more pertinent art than that listed above exists, and no such representation should be inferred.
Power semiconductive devices, such as bipolar power transistors, typically are mounted on heat sinks which conduct away from the active regions of such devices heat evolved by the active regions of such devices during their operation. Examples include power transistors in the output stages of audio amplifiers operating in classes A and AB. These devices are required to be mounted in such ways as to be capable of dissipating powers of the same order of magnitude as is delivered to the loads, typically the voice coils of loudspeakers, they are driving. These powers must be dissipated in order to prevent damage to the devices themselves. Usually, this is accomplished by mounting such devices on heat sinks, massive structures of highly heat conductive material, for example, aluminum, mounted to, or formed as part of, the chassis of the electrical equipment of which the power semiconductive devices are components.
In the past, threaded fasteners have routinely been used to mount such power semiconductive devices to such heat sinks. This is problematic for a number of reasons, not the least of which is that the headers of such devices, which are, by design, frequently maintained at the same electrical potentials as one of the terminals, for example, the collector, of the devices, are also the components of the devices through which pass the threaded fasteners used to attach the devices to the heat sinks. This requires that some care be exercised in mounting the devices to the heat sinks in ways which will promote the flow of heat from the devices, but maintain electrical insulation of the devices from the heat sinks. Alternatively, the chassis of such electrical equipment must be designed in such a way as to accommodate heat sinks at the electrical potential of one of the terminals of the electrical devices mounted on them. This, in turn, may require multiple heat sinks, each electrically insulated not only from other heat sinks on the same electrical equipment but also typically from the chassis of the electrical equipment itself.
DISCLOSURE OF THE INVENTION
According to one aspect of the invention, a heat sink is formed from first and second components including first and second engagement means, respectively. The first engagement means is designed for receiving the second engagement means. One of the components includes at least one clamping leg. The other of the components includes a surface. The clamping leg is designed to snap over the surface to couple the two components together and capture between the first and second components in heat conducting relationship with at least one of the first and second components at least one device which evolves heat during its operation.
Illustratively according to this aspect of the invention, the first and second components include a base component and a clamping component.
Additionally illustratively according to this aspect of the invention, the first engagement means includes a groove provided in the base component.
Further illustratively according to this aspect of the invention, the clamping legs are formed on the clamping component.
Illustratively according to this aspect of the invention, means are provided for at least partially electrically insulating the one or more devices from the first and second components.
According to another aspect of the invention, a method of dissipating heat evolved by an electrical device includes capturing the device between first and second components in heat conducting relationship with at least one of the first and second components. The first and second components are provided with first and second engagement means, respectively. The first engagement means receives the second engagement means. At least one clamping leg is provided on one of the components. A surface for engagement by the clamping leg to couple the two components together is provided on the other of the components.
Illustratively according to this aspect of the invention, providing the first and second components includes providing a base component and a clamping component.
Further illustratively according to this aspect of the invention, providing the first engagement means includes providing a groove.
Additionally illustratively according to this aspect of the invention, providing the groove includes providing the groove in the base component.
Illustratively according to this aspect of the invention, providing the second engagement means includes providing a clamping component.
Further illustratively according to this aspect of the invention, providing the clamping leg includes providing the clamping leg on the clamping component.
Additionally illustratively according to the present invention, providing the second engagement means includes providing a tab on the clamping component.
Illustratively according to this aspect of the invention, the method further includes at least partially electrically insulating the device from the first and second components.
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Barnes & Thornburg
Datskovsky Michael
Harman International Industries Incorporated
Picard Leo P.
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