Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-12-25
2007-12-25
Tran, Minhloan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S048000, C257SE23078
Reexamination Certificate
active
10975013
ABSTRACT:
A mounting member of a semiconductor device according to the present invention includes a wiring substrate to input and/or output actuating signals to a semiconductor device, a power supplying conductor plate to supply actuating power to the semiconductor device, and the GND conductor plate. The wiring substrate, the power supplying conductor plate, and the GND conductor plate are laminated with insulation films between respective layers. Input/output signals as well as minute driving current is supplied from wiring substrate, and the large main driving current is supplied through the power supplying conductor plate as well as the GND conductor plate.
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Espec Corp.
Harness & Dickey & Pierce P.L.C.
Rodela Eduardo A.
Tran Minhloan
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