Mounting mechanism for mounting heat sink on multi-chip module

Details Mounting mechanism for mounting heat sink on multi-chip module Mounting mechanism for mounting heat sink on multi-chip module

1990-10-29

1992-04-28

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 81, 361387, 165 803, H05K 720

Patent

active

051093170

ABSTRACT:
A cooling structure for cooling a multi-chip module by a heat sink is disclosed in which the heat sink is disposed above the multi-chip module in a state that heat-conductive grease is sandwiched between the heat sink and the module cap of the multi-chip module, and the heat sink, the module cap and the wiring board of the multi-chip module are clamped as one body by clamp member, and in which a heat-sink pushing member for pressing the heat sink against the module cap by a constant force is attached to the clamp members.

REFERENCES:
patent: 3946276 (1976-03-01), Braun
patent: 4115836 (1978-09-01), Hutchinson
patent: 4235283 (1980-11-01), Gupta
patent: 4342068 (1982-07-01), Kling
patent: 4563725 (1986-01-01), Kirby
patent: 4612601 (1986-09-01), Watari
patent: 4653828 (1989-08-01), Penn
patent: 4833567 (1989-05-01), Saaski
patent: 4935864 (1990-06-01), Schmidt

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