Mounting integrated circuit elements

Details Mounting integrated circuit elements Mounting integrated circuit elements

1974-03-12

1976-04-06

Lanham, C. W.

Metal working

Method of mechanical manufacture

Electrical device making

29577, 29589, 29625, 156 3, 357 71, 357 74, H05K 330, H05K 332

Patent

active

039479579

ABSTRACT:
A multi layer printed circuit interconnection system together with pillars for mounting integrated circuit components is progressively formed layer by layer by successive sequences for each layer, involving using a photo resist to produce a pattern of apertures defining circuit tracks and the pillar positions, depositing metal to form the tracks and the pillars and replacing the remainder of the resist with insulation material. Openings co-operating with the pillars, for the circuit elements are produced during formation of the outermost insulation layer of the circuit system.
The circuit elements are mounted on the pillars and the connections between the elements and the printed circuit system are formed by using a further one of said sequences.

REFERENCES:
patent: 3366519 (1968-01-01), Pritchard et al.
patent: 3525617 (1970-08-01), Bingham
patent: 3540954 (1970-11-01), Pritchard et al.
patent: 3622384 (1971-11-01), Davey et al.
patent: 3679941 (1972-07-01), Lacombe et al.
patent: 3691628 (1972-09-01), Kim et al.
patent: 3726002 (1973-04-01), Greenstein et al.
patent: 3846166 (1974-11-01), Saiki et al.
The Electronic Engineer, "ISSCC-Consumer Products Got a Piece of the Action," Socolovsky, Weniger, Edelman, Apr. 1968, pp. 92-96.

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