Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-04-27
2001-08-28
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S121000, C361S719000, C454S184000
Reexamination Certificate
active
06282091
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to mounting devices for a heat-generating element (e.g., a central processing unit) and a heat-dissipating device, and more particularly to mounting devices that can be easily and securely engaged with the heat-generating element to obtain a minimized thickness after assembly, thereby obtaining an optimal heat-dissipating effect.
2. Description of the Related Art
Taiwan Utility Model Publication No. 346211 issued on Nov. 21, 1998 and entitled “IMPROVED STRUCTURE FOR HEAT-DISSIPATING DEVICES” discloses a heat-dissipating plate, a fan, and a holding member for fixing the fan and for maintaining a gap between the fan and the heat-dissipating plate. A retainer is provided to be engaged with the heat-dissipating plate by bolts and nuts and to retain the central processing unit in place. Thus, the heat-dissipating plate may be securely engaged with the central processing unit. Nevertheless, the retainer has a certain thickness and thus fails to obtain a minimized thickness, as the heat-dissipating device after assembly is elevated above the surface of the circuit board by an increased height that is equal to the thickness of the retainer.
SUMMARY OF THE INVENTION
It is a primary object of the present invention to provide a mounting device for the heat-generating element and the heat-dissipating device. The mounting device is simple in structure and easy to manufacture, and the heat-dissipating device is elevated by a lower level after assembly, thereby providing an optimal heat-dissipating effect.
In accordance with the present invention, a number of posts are formed on an underside of a cover plate of a heat-dissipating device. The posts are extended through positioning holes on a base of the heat-dissipating device. The posts may have snap fasteners that are extended through positioning holes in a circuit board on which a heat-generating element is mounted. Alternatively, each post is extended through an engaging member that has an engaging peg projected therefrom. Each engaging peg has a snap fastener for engaging with an associated positioning hole of the circuit board. An elastic element is sleeved around each post or each engaging peg, thereby providing the snap fastener with reliable snapping effect. Thus, the base of the heat-dissipating device and the heat-generating element are tightly contact with each other to obtain excellent heat conduction therebetween.
Other objects, specific advantages, and novel features of the invention will become more apparent from the following detailed description and preferable embodiments when taken in conjunction with the accompanying drawings.
REFERENCES:
patent: 5734553 (1998-03-01), Hong
patent: 5873406 (1999-02-01), Horng
patent: 5880930 (1999-03-01), Wheaton
patent: 5940269 (1999-08-01), Ko et al.
patent: 6037660 (2000-03-01), Liu
patent: 6053242 (2000-04-01), Hsieh
patent: 6105215 (2000-08-01), Lee
patent: 6157539 (2000-12-01), Wagner et al.
patent: 346211 (1998-11-01), None
Bacon & Thomas PLLC
Sunonwealth Electric Machine Industry Co. Ltd
Tolin Gerald
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