Mounting device for mounting an electronic device on a substrate

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174262, 174263, 29832, H05K 100

Patent

active

053269365

ABSTRACT:
A mounting device for mounting an electronic device on a substrate is described. The electronic device has a plurality of interconnection pins for engagement with corresponding through-holes on the substrate for electric interconnection. The mounting device incorporates a plate member of an insulating material provided with a plurality of counter-bores on an upper major surface of the plate member in correspondence to the interconnection pins of the electronic device, a plurality of through-holes provided on the plate member in correspondence to each of the counter-bores in a concentric relationship to the counter-bore, and a plurality of solder rings provided on the plurality solder rings provided on the plurality of counter-bores.

REFERENCES:
patent: 4142286 (1979-03-01), Knuth et al.
patent: 4216350 (1980-08-01), Reid
patent: 5019944 (1991-05-01), Ishii et al.
patent: 5117330 (1992-05-01), Miazaga
"Pin and Solder Ring Loader", Cioffi, Jr., et al., IBM Technical Disclosure Bulletin, vol. 21, No. 7, Dec., 1978, pp. 2912-2913.

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