Mounting device for high frequency microwave devices

Details Mounting device for high frequency microwave devices Mounting device for high frequency microwave devices

2007-10-23

2007-10-23

Ngô, Ngân V. (Department: 2818)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S121000, C438S122000, C257SE21499

Reexamination Certificate

active

10930350

ABSTRACT:
In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N/cm2or greater owing to fastening.

REFERENCES:
patent: 3982271 (1976-09-01), Olivieri et al.
patent: 5898909 (1999-04-01), Yoshihara et al.
patent: 5901039 (1999-05-01), Dehaine et al.
patent: 6222741 (2001-04-01), Drennen et al.
patent: 2004/0036162 (2004-02-01), Chuang et al.
patent: 2004/0232447 (2004-11-01), Crane et al.
patent: 2006/0108672 (2006-05-01), Brennan et al.
patent: 0 840 443 (1998-05-01), None
patent: 2 630261 (1989-10-01), None
patent: 57-177544 (1982-11-01), None
patent: 05-055419 (1993-03-01), None
patent: 5-75283 (1993-03-01), None
patent: 08-23183 (1996-01-01), None
patent: 9-92955 (1997-04-01), None
patent: 09-92955 (1997-04-01), None
patent: 10-283650 (1998-10-01), None
patent: 10-322066 (1998-12-01), None
patent: 11-110084 (1999-04-01), None
patent: 11-250032 (1999-09-01), None
patent: 2000-165077 (2000-06-01), None
patent: 2000-223629 (2000-08-01), None
patent: 2000-232284 (2000-08-01), None
patent: 2000-338605 (2000-12-01), None
Supplementary Partial European Search Report dated Jul. 18, 2007, from the corresponding European Application.
Norm Dye, et al. “Using FR Transistors Power Construction Techniques” Electronics World, Nexus Media Communications, vol. 100, No. 1696, Mar. 1, 1994, pp. 218-223.

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