Mounting construction and method of a semiconductor device by wh

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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257666, 257696, H01L 2348, H01L 2352

Patent

active

055571450

ABSTRACT:
There is provided a mounting construction which prevents leads of a semiconductor device from being short circuited when the semiconductor device is mounted on a mounting board so that mountability of the semiconductor device is improved. A plurality of outer leads extend from sides of a package of the semiconductor device. A mounting board has a surface on which a plurality of terminals to be electrically connected to the semiconductor device are provided. A mounting member is mounted on the mounting board separately from the semiconductor device. The semiconductor device is attached to the mounting member. The mounting member has a frame member forming a space in which the semiconductor device is placed. A first connecting lead has a first lead connecting portion and a first external connecting portion to be connected to a one of terminals provided on the mounting board. The first external connecting portion extends along a bottom surface of the frame member. A second connecting lead has a second lead connecting portion and a second external connecting portion to be connected to a one of the terminals provided on the mounting board. The second external connecting portion extends along a bottom surface of the frame member. The first external connecting portion and the second external connecting portion are arranged alternately with a predetermined distance apart from each other in a direction along an extending direction of the frame member.

REFERENCES:
patent: 5105261 (1992-04-01), Ueda et al.
patent: 5185653 (1993-02-01), Switky et al.
patent: 5471097 (1995-11-01), Shibata

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