Mounting board, height adjusting apparatus and mounting method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S809000, C361S810000, C174S13800J, C174S13800J

Reexamination Certificate

active

07872875

ABSTRACT:
An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the thermally-meltable bonding material so as to maintain a predetermined distance between the electronic part and the mounting board.

REFERENCES:
patent: 5684677 (1997-11-01), Uchida et al.
patent: 5964396 (1999-10-01), Brofman et al.
patent: 6688828 (2004-02-01), Post
patent: 6850411 (2005-02-01), Patel
patent: 2005/0248026 (2005-11-01), So
patent: 2008/0079129 (2008-04-01), Ganapathysubramanian et al.
patent: 7-74450 (1995-03-01), None
patent: 11-111776 (1999-04-01), None
patent: 2000-150709 (2000-05-01), None
patent: 2001-127113 (2001-05-01), None

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