Mounting board and electronic device using same

Details Mounting board and electronic device using same Mounting board and electronic device using same

2006-02-28

2006-02-28

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C361S777000, C257S778000

Reexamination Certificate

active

07005585

ABSTRACT:
Wiring electrodes are formed on a first principal surface of a base substrate. An insulation film partially covers the first principal surface of the base substrate and the wiring electrodes. The insulation film has opening portions where the base substrate and the wiring electrodes are not coated with the insulation film. An electronic component having bump electrodes is mounted on the mounting board by connecting the bump electrodes with the wiring electrodes in the opening portions. A gap between the first principal surface of the base substrate and the electronic component is filled with sealing resin. The opening portions are substantially orthogonal to the longitudinal direction of the wiring electrodes. The ratio of the minimum width of a portion of the base substrate exposed at each of the opening portions to the thickness of the insulation film may advantageously be greater than or equal to 2.

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Austrian Patent Office Search Report and Examination Report.
Japanese Examination Report (Aug. 30, 2005) with English language translation.

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