Mounting base pad means for semiconductor devices and method of

Details Mounting base pad means for semiconductor devices and method of Mounting base pad means for semiconductor devices and method of

1986-12-22

1988-07-05

Ball, Michael

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156257, 156297, 165185, 174138G, 174 16HS, B32B 3118, F28F 700, H01B 1904

Patent

active

047552492

ABSTRACT:
A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and comprising a thin layer of silicone base rubber. The base pad an flange walls are formed of a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof, and wherein the core is composed of a thin layer of silicone base rubber.

REFERENCES:
patent: 3427715 (1969-02-01), Mika
patent: 3673543 (1972-06-01), Garner
patent: 4481525 (1984-11-01), Calabro
patent: 4572757 (1986-02-01), Spadafora
"Silastic RTV", Dow Corning Corp., 1961.

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