Mounting base pad means for semiconductor devices and method of

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Details

357 71, H01L 2312, H01L 2314, H01L 2336

Patent

active

048537632

ABSTRACT:
A mounting pad means for use in combination with solid-state semiconductive translating devices and including a base pad with flange walls extending from said base pad, and with device mounting pad means being secured to the surface of the base pad and comprising a thin layer of silicone base rubber. The base pad an flange walls are formed of a generally rigid laminate with a core having outer metal foil layers disposed on opposite surfaces thereof, and wherein the core is composed of a thin layer of silicone base rubber.

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