Mounting assembly of integrated circuit device and method for pr

Details Mounting assembly of integrated circuit device and method for pr Mounting assembly of integrated circuit device and method for pr

1998-03-02

2000-03-14

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257774, 257778, 257775, 257780, 257776, 361777, 361778, 361760, H01L 2348

Patent

active

060376651

ABSTRACT:
A mounting assembly of an integrated circuit device includes an integrated circuit device having pads on its lower side, through holes formed in a mounting substrate at positions opposed to the pads of the integrated circuit device, and solders for connecting the pads of the integrated circuit device with the through holes. An electrode is provided on the inside wall of each through hole, and the mounting substrate includes therein wirings connected to the electrodes. The solder is filled into the through holes to such an extent that the solder filled in the through holes can be visually checked from the lower side of the substrate.

REFERENCES:
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5459368 (1995-10-01), Onishi et al.
patent: 5489750 (1996-02-01), Sakemi et al.
patent: 5784262 (1998-07-01), Sherman

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