Mounting assembly for semiconductive controlled rectifiers

Details Mounting assembly for semiconductive controlled rectifiers Mounting assembly for semiconductive controlled rectifiers

1979-02-01

1980-09-23

Miller, J. D.

Electric power conversion systems

Current conversion

With conductive support mounting

361388, 357 79, 357 81, H01L 2340

Patent

active

042246636

ABSTRACT:
A mounting assembly for press-pack semiconductive controlled rectifiers wherein the rectifiers are all thermally connected to the same heat sink using an insulating medium, the rectifiers being electrically interconnected using common bus bars as required to provide a desired alternating current or direct current connection. A common spring arrangement is used to apply appropriate pressure to at least two semiconductors at once to hold them in contact with their associated bus bars. At least one of the interconnecting bus bars for the rectifiers is formed of a malleable conducting medium, such as copper, formed and used in a manner to provide load equalizing and surface alignment such that the spring can transmit uniform pressure to the heat sink and the semiconductive controlled rectifiers.

REFERENCES:
patent: 3356902 (1967-12-01), Blaikie
patent: 3688159 (1972-08-01), Robbins
patent: 3955122 (1976-05-01), Maynard et al.
patent: 4126883 (1978-11-01), Martin
patent: 4128870 (1978-12-01), Knobloch et al.
patent: 4161016 (1979-07-01), Born et al.

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