Mounting assemblies for a plurality of transistor integrated cir

Details Mounting assemblies for a plurality of transistor integrated cir Mounting assemblies for a plurality of transistor integrated cir

1975-02-21

1976-07-27

Wojciechowicz, Edward J.

357 69, 357 74, 357 81, 357 84, H01L 2348, H01L 2302, H01L 2504, H01L 2944

Patent

active

039720624

ABSTRACT:
A mounting assembly for a power transistor integrated circuit chip having a pair of electrodes on one surface thereof comprising base and emitter connections and a third electrode on the opposite surface thereof comprising the collector connection, is fabricated by the method including the steps of providing an electrically conductive strip having a central cavity extending the length thereof, the depth of the cavity being substantially equal to the height of the chip and the strip also including arms extending outwardly at opposite sides of the cavity; tinning the strip with solder; placing transistor chips in the cavity adjacent each other with the collector electrodes thereof being in contacting engagement with the strip; heating the strip with the chips therein to reflow the solder for connecting the chips thereto at the collector electrode; and severing the strip transverse the length thereof between chips to provide individual power transistor chip mounting assemblies each having a pair of outwardly extending support feet formed from the severed arms of the strip. The mounting assembly can be mounted to printed circuit conductors which are in-line by soldering the support feet to predetermined ones of the conductors and the base and emitter electrodes to others of the conductors.

REFERENCES:
patent: 3728589 (1973-04-01), Caulton

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