Mounting arrangement for semiconductor optoelectronic devices

Details Mounting arrangement for semiconductor optoelectronic devices Mounting arrangement for semiconductor optoelectronic devices

1980-05-05

1982-09-07

Weisstuch, Aaron

Metal working

Method of mechanical manufacture

Assembling or joining

29588, 357 80, 357 81, H01L 3300

Patent

active

043476554

ABSTRACT:
A new package for semiconductor optoelectronic devices is disclosed, which comprises a novel geometrical configuration and provides plug-in capability. The package configuration provides a convenient means for supplying electrical signals to or from the device(s) within the package while maintaining a coaxial geometry, useful in optical and thermal control. Techniques for bonding devices into the package are easily automated using conventional bonding and assembly equipment. The package permits use of the device in a variety of orientations.

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patent: 3840889 (1974-10-01), O'Brien et al.
patent: 3869702 (1975-03-01), Backhouse et al.
patent: 3913040 (1975-10-01), Rosen et al.
patent: 3946416 (1976-03-01), Hacskaylo
patent: 4003074 (1977-01-01), Yonezu et al.
patent: 4097891 (1978-06-01), Selway et al.

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