Mounting arrangement for semiconductor devices

Details Mounting arrangement for semiconductor devices Mounting arrangement for semiconductor devices

1994-03-24

1996-04-16

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 361760, 361748, 439 55, 439 78, 439 83, 439 81, H05K 118

Patent

active

055084761

ABSTRACT:
An arrangement for making fatigue-free external connections to a device mounted on a direct copper bonded substrate, in which one or more connector tubes are brazed to respective copper areas on the substrate before the device is mounted on the substrate, and external connections are made by soldering leads or bus bars into the tubes.

REFERENCES:
patent: 3778530 (1973-12-01), Reimann
patent: 4634638 (1987-01-01), Ainslie et al.
patent: 4970570 (1990-11-01), Agarwala et al.
patent: 5198885 (1993-03-01), Ibrahim
patent: 5329160 (1994-07-01), Miura et al.
patent: 5400489 (1995-03-01), Hegner et al.

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