Mounting arrangement for securing an intergrated circuit package

Details Mounting arrangement for securing an intergrated circuit package Mounting arrangement for securing an intergrated circuit package

1997-10-22

1999-02-09

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Device held in place by clamping

257718, 257714, 257726, 257732, H05K 700, H05K 720, H01L 2300

Patent

active

058698973

ABSTRACT:
A top surface of a protective cover of an IC component package is provided with a centered-protrusion, e.g., such as a cylindrical peg, that extends above the cover. A retaining-spring is formed by twisting a resilient (e.g., metal) metal strip into a ribbon-like shape having opposing ends that extend from a curvelinear bottom surface. The bottom surface of the retaining-spring is provided with an opening configured to mate with the centered protrusion on the package cover, such that the opposing ends of the retaining-spring extend away from the package cover at substantially the same, albeit reverse angles. In order to mount the IC package to a heat sink, the bottom surface of the retaining-spring may be compressively mated onto the package cover at the same time the package is inserted between two substantially parallel walls protruding from the heat sink surface, wherein the walls are distanced from each other. just so as to cause moderate compression of the opposing ends of the spring toward each other as the package is inserted against the heat sink surface. The opposing surfaces of the two walls are provided with a plurality of notches formed substantially parallel to the heat sink surface in a "ratchet-type" relief pattern, such that the opposing ends of the retaining-spring are held into place by respective notches, once the IC package is secured against the heat sink.

REFERENCES:
patent: 5345107 (1994-09-01), Daikoku et al.
patent: 5641976 (1997-06-01), Taguchi et al.
patent: 5648893 (1997-07-01), Loo et al.

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