Mounting arrangement for disc mounted semiconductor devices

Details Mounting arrangement for disc mounted semiconductor devices Mounting arrangement for disc mounted semiconductor devices

1980-11-28

1983-09-13

Edlow, Martin H.

357 76, H01L 2342

Patent

active

044045824

ABSTRACT:
An assembly of disc mounted, compression bonded-encapsulated, semiconductor devices is provided with positioning elements from the sheet metal serving as a heat sink and electrical bus adjacent the device contact face. A plurality of holding fingers stamped from the sheet metal grip the device side surface and permit placing the device in position accurately so the clamping elements apply proper force along the device axis.

REFERENCES:
patent: 4247864 (1981-01-01), Lockard

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