Mounting arrangement for chassis and printed circuit board with

Metal fusion bonding – Process – With supplementary mechanical joining

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Details

228101, 228170, 228180R, H01L 334

Patent

active

040761657

ABSTRACT:
An improved mounting arrangement and method of assembly provides for mounting parts on both chassis and board, then mating the two before soldering by means of a twist-tab-and-slot arrangement. The conformation and dimensions of the tab and slot prevent warpage during soldering, enabling the use of the chassis as a board carrier in the wave soldering process.

REFERENCES:
patent: 2722625 (1955-11-01), Bingeman et al.
patent: 2762987 (1956-09-01), Mackey
patent: 2898518 (1959-08-01), Lynn
patent: 3407261 (1968-10-01), Donath et al.
patent: 3973322 (1976-08-01), Boynton et al.

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