Mounting arrangement for a semiconductor device

Details Mounting arrangement for a semiconductor device Mounting arrangement for a semiconductor device

1992-06-05

1993-08-03

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

29827, 361767, 361807, H05K 100

Patent

active

052331342

ABSTRACT:
In the disclosed semiconductor device mounting arrangement, an integrated circuit has an elastic body on one surface and protruding electrodes on the opposite surface and a support frame includes a pressing member to engage the elastic body directly so as to force the protruding electrodes into engagement with a wiring pattern formed on a substrate. In the disclosed semiconductor device mounting method, a liquid crystal display panel having an integrated circuit with protruding electrodes is placed on a wiring pattern and an elastic body is provided on the surface of the integrated circuit which is opposite from the protruding electrodes. The assembled components are positioned between a pressing portion and a base member of a support frame so that the elastic body is compressed and the reaction from the compression is utilized to engage the protruding electrodes with the wiring pattern.

REFERENCES:
patent: 4605986 (1986-08-01), Bentz et al.
patent: 4845842 (1989-07-01), Miller et al.

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