Mounting apparatus of solder-balls

Details Mounting apparatus of solder-balls Mounting apparatus of solder-balls

1995-08-18

1997-05-06

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

228246, B23K 300, B23K 306

Patent

active

056262779

ABSTRACT:
A solder-ball mounting apparatus is provided with a ball feed jig having a ball tank that may receive a predetermined number of solder-balls for feeding the solder-balls to a ball suction jig through a guide mask mounted on an opening portion of the ball tank, and blowout holes formed in a bottom of the ball tank for a blow gas as a blow unit for agitating the solder-balls received in the ball tank in the ball feed jig. The solder-balls may be positively sucked to ball suction holes one by one without turning over the ball suction jig.

REFERENCES:
patent: 4462534 (1984-07-01), Bitaillou et al.
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 5467913 (1995-11-01), Namekawa et al.
patent: 5516032 (1996-05-01), Sakemi et al.

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