Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
2008-07-18
2010-10-19
Banks, Derris H (Department: 3729)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S743000, C029S742000, C029S739000, C029S757000, C029S760000, C438S120000, C257SE21518, 51
Reexamination Certificate
active
07814645
ABSTRACT:
A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.
REFERENCES:
patent: 4790067 (1988-12-01), Grindle
patent: 2005/0227429 (2005-10-01), Minamitani et al.
patent: 3368494 (2002-11-01), None
patent: 2003-282644 (2003-10-01), None
patent: 2004-87610 (2004-03-01), None
patent: 3747849 (2005-12-01), None
Asakura Tomomi
Miyagoshi Toshinobu
Mizuno Toru
Saito Yuji
Takano Hiroyuki
Banks Derris H
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Parvez Azm
TDK Corporation
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