Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-08-10
2000-08-08
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156292, 156382, 269 21, B32B 3100
Patent
active
060996811
ABSTRACT:
When applying a flux 2 kept in a container 16 onto a conductive ball 1, the flux 2 is first applied by a squeegee unit 17 on a bottom 16a of container 16 in the form of layer having a certain predetermined layer thickness. Then, a suction head 20 holding a solder ball 1 is lowered towards the container 16. As soon as a touch sensor 43 detects a touching of the solder ball 1 to the bottom 16a, the suction head 20 is lifted, and the solder ball 1 held to the suction head 20 is transferred onto a workpiece. Thus a solder ball 1 may be transferred onto a workpiece after being applied with a certain specific amount of flux 2 with precision.
REFERENCES:
patent: 5558732 (1996-09-01), Hamon
Arikado Kazuo
Nakazato Shinichi
Lorin Francis J.
Matsushita Electric - Industrial Co., Ltd.
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