Mounting apparatus for mounting chip component on mounting porti

Details Mounting apparatus for mounting chip component on mounting porti Mounting apparatus for mounting chip component on mounting porti

1993-11-30

1995-09-05

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 62, 228 8, 2282331, H01L 2160

Patent

active

054472660

ABSTRACT:
A collet for holding a die with a vacuum force is provided with a linear motor. At the time of bonding the die to a lead frame, a control unit controls the linear motor to mount the die, held by the collet, onto the mounting portion of the lead frame. At this time, the control unit gradually increases the torque of the linear motor to gradually press the die. This reduces the impact load applied to the die, preventing the die from being cracked.

REFERENCES:
patent: 4444349 (1984-04-01), Bilane et al.
patent: 4789095 (1988-12-01), Kobayashi
patent: 5060841 (1991-10-01), Oshima et al.
patent: 5207370 (1993-05-01), Mochida et al.
patent: 5285946 (1994-02-01), Tomigashi et al.
patent: 5351872 (1994-10-01), Kobayashi
Kobayashi et al Patent Abstracts of Japan 62-271537 May 1, 1989.

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