Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-08-08
2006-08-08
Koch, George (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S358000, C156S359000, C156S360000, C438S016000, C100S050000, C100S048000
Reexamination Certificate
active
07087126
ABSTRACT:
A mounting apparatus includes: a heater head for bonding a liquid crystal display and a flexible printed circuit board by thermocompression; a cylinder as a heater head driving means for driving heater head to compress the liquid crystal display and flexible printed circuit board by a prescribed load; and a control mechanism as a stretch amount controlling means for adjusting a load change per unit of time after the heater head starts compressing the flexible printed circuit board by the cylinder as well as a time at which a required load is attained to control the stretch amount of the flexible printed circuit board by thermocompression. Preferably, the mounting apparatus is provided with a mechanism which performs measurement after preliminary bonding and which performs regular bonding while controlling based on the obtained information.
REFERENCES:
patent: 5243755 (1993-09-01), Inaba et al.
patent: 5858806 (1999-01-01), Nishida
patent: 6458236 (2002-10-01), Takeshita et al.
patent: 7-231008 (1995-08-01), None
patent: 8-114812 (1996-05-01), None
patent: 9-5381 (1997-01-01), None
patent: 11-054877 (1999-02-01), None
patent: 11-251372 (1999-09-01), None
JP Notice of Ground of Rejection and English translation thereof mailed Mar. 22, 2005 in corresponding JP application No. 2001-085339.
Nagata Katsunori
Nakagawa Toshihiko
Ooga Masaaki
Sugimoto Shinichi
Koch George
Nixon & Vanderhye P.C.
Sharp Kabushiki Kaisha
LandOfFree
Mounting apparatus and mounting method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mounting apparatus and mounting method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mounting apparatus and mounting method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3713164