Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1985-09-25
1988-04-19
Tolin, Gerald P.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
357 79, 357 81, 363144, H05K 720
Patent
active
047394471
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a device for mounting and connecting at least one power semi-conductor component to a unilateral heat sink. Such a device comprises the heat sink and a clamping device associated with each semi-conductor component for applying it against the heat sink and bearing, on the heat sink and on the semi-conductor component through a connecting bar.
Known mounting devices for power semi-conductors with unilateral cooling. that is to say provided on a single face of the semi-conductor, sometimes use an insulating case of a height sized as a function of that of the semi-conductor; in the case there is provided a spring calibrated so as to produce the prescribed clamping force. The electric power connection is provided either by means of a threaded rod extending from the case at the upper part thereof, or by a rigid connection strip extending from the case on one of the sides thereof.
Such a device has the disadvantage of requiring a restrictive association of the semi-conductor component, its case and the clamping spring, in particular as a function of the height and diameter of the component; in addition, the connecting mode used involves a cascade of electric contacts causing successive overheatings harmful for the semi-conductor and/or mechanical stresses due to rigid connections and adversely effecting the reliability of the semi-conductor;
In another known mounting device, of the bilateral cooling type, that is to say through both faces of the semi-conductor component, clamping clips are used for clamping together two heat sinks enclosing the semi-conductor. The clip comprises a calibrated spring for obtaining the prescribed clamping force. In this case, the electric connections are formed on the heat sinks which also provide the function of electric conductors.
Such a device, transposed to unilateral cooling mounts comprising one or more semi-conductor components, has the disadvantage of having to be adapted when it is desired to use semi-conductors of different heights or with wide height tolerances, either during the original mounting, or during replacement of a semi-conductor in the place of use. The desired adaptation is obtained by means of a braided connection or by means of a rigid connection with insertion of shims or other systems for bringing to the desired dimensions. These solutions as a whole have the disadvantage of being relatively expensive.
The purpose of the present invention is more especially to overcome the above mentioned defects and to create a simple device adapted to semi-conductor power components of varying heights and facilitating the mounting and connection of said components.
Its aim is to avoid the transmission to such semi-conductor components of the forces likely to be exerted on the connection elements of the device.
SUMMARY OF THE INVENTION
The invention provides then a mounting and connection device of the above mentioned type in which the connection bar inserted between the semi conductor component and the clamping device thereof is laminated so as to have in the direction of its length a great flexibility from a fixing zone on a fixed support.
The result is that the connection device adapts itself, without any adjustment or addition of shims, to semi-conductors of heights varying depending on their origin or on their manufacturing tolerances.
The laminated bar may advantageously be secured by fixing means to the fixing zone of the support formed by an insulating frame, itself fixed to the heat sink, so as to be able to bend from this fixing zone as far as its clamping zone to said semi-conductor (s). The result is the possibility of easily removing the bar and a great ease in replacing the semi-conductors.
When the device comprises several semi-conductor components, the insulating frame may have, between two adjacent semi-conductors, a bearing point for the laminated bar, the height of this bearing point with respect to the surface of the heat sink on which the semi-conductors rest b
REFERENCES:
patent: 4169975 (1971-10-01), Block
patent: 4218695 (1980-08-01), Egerbacher et al.
patent: 4224663 (1980-09-01), Maise et al.
patent: 4288837 (1981-09-01), Prager et al.
patent: 4518982 (1985-05-01), DuBois et al.
Drucker William A.
Gaffin Jeffrey A.
La Telemecanique Electrique
Tolin Gerald P.
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