Mounted semiconductor device and a method for making the same

Details Mounted semiconductor device and a method for making the same Mounted semiconductor device and a method for making the same

2008-07-02

2010-10-19

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Electron emitter manufacture

C438S040000, C438S043000, C438S106000, C438S108000, C438S113000, C438S548000, C438S460000, C438S706000, C438S735000, C257SE21023, C257SE21246, C257SE21503, C257SE21504, C257SE21509, C257SE21599, C257SE23017, C257SE23023

Reexamination Certificate

active

07816155

ABSTRACT:
A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconductor device is in between the values of coefficients of thermal expansion of the materials of the submount and the heat sink, the thickness of the submount being chosen so as to equalize thermal expansion of the semiconductor device to that of the surface of the submount the device is mounted on. According to another aspect of the invention, the semiconductor device, the submount, and the heat sink are soldered into a stack at a single step of heating, which facilitates reduction of residual post-soldering stresses.

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