Metal fusion bonding – With control means responsive to sensed condition
Patent
1995-06-30
1996-10-01
Heinrich, Samuel M.
Metal fusion bonding
With control means responsive to sensed condition
228102, H05K 334
Patent
active
055605338
ABSTRACT:
A mounted circuit board producing system includes a plurality of mounted circuit board production lines having a solder printing unit, a component mounting unit, and a soldering unit. The system includes an inspection device for inspecting at least one equipment at the solder printing unit, component mounting unit, and soldering unit and given monitor items with respect to circuit boards to be mounted, a data analyzing part for analyzing, according to a warning criterion applicable prior to a predetermined defective judgement criterion being reached, qualitative conditions of both the equipment and individual circuit boards from results of inspections made by the inspection device, and a control device for controlling, on the basis of analysis results at the data analyzing part, at least one of the solder printing unit, component mounting unit, and soldering unit for a change of operating conditions over the entire production line.
REFERENCES:
patent: 4653682 (1987-03-01), Dines et al.
patent: 4677473 (1987-06-01), Okamoto et al.
Heinrich Samuel M.
Matsushita Electric - Industrial Co., Ltd.
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